| 填料种类 |
粒径(μm) |
孔径(A) |
孔容(mL/g) |
比表面(m2/g) |
键合相 |
封尾方式 |
碳含量(wt%) |
货号 |
| XPureway系列杂化硅胶填料 |
3.5/5 |
130 |
0.7 |
185 |
裸硅胶 |
No |
6% |
HP-X35-13-C00-F0
HP-X50-13-C00-F0
|
| 3.5/5 |
130 |
0.7 |
185 |
tC18 |
双封尾 |
18% |
HP- X35-13-t18-F2
HP- X50-13-t18-F2
|
| 3.5/5 |
130 |
0.7 |
185 |
C18 |
双封尾 |
20% |
HP-X35-13-C18-F2
HP-X50-13-C18-F2
|
| 3.5/5 |
130 |
0.7 |
185 |
tC8 |
双封尾 |
13% |
HP-X35-13-t08-F2
HP-X50-13-t08-F2
|
| 3.5/5 |
130 |
0.7 |
185 |
C8 |
双封尾 |
14% |
HP-X35-13-C08-F2
HP-X50-13-C08-F2
|
| 3.5/5 |
130 |
0.7 |
185 |
RP18 |
Yes |
17% |
HP-X35-13-R18-F1
HP-X50-13-R18-F1
|
| 3.5/5 |
130 |
0.7 |
185 |
Pheny1 |
Yes |
15% |
HP- X35-13-Phe- F1
HP- X50- 13-Phe-F1
|
| 3.5/5 |
130 |
0.7 |
185 |
Amide |
No |
12% |
HP-X35- 13-Ami-F1
HP- X50-13-Ami-F1
|
| 3.5/5 |
130 |
0.7 |
185 |
二醇基 |
No |
N/A |
HP-X35-13-0H2-F0
HP-X50-13-0H2-F0
|
